Thermal Compound Gelid-Solutions GC-4-3.5g (Pack of 5)

The Gelid-Solutions GC-4-3.5g Thermal Compound is an advanced thermal interface designed specifically for professional and extreme users seeking optimal cooling performance for their CPUs, GPUs, chipsets, and other critical applications. It features a state-of-the-art polymer matrix that acts as a binder for the thermal filler particles, ensuring even distribution and perfect gap filling between the heat source and cooling solution. This cutting-edge compound offers superior heat transfer efficiency, maximizing cooling performance while maintaining excellent stability and reliability over a wide temperature range (-30 to 150°C).

With a non-electrical conductive and non-corrosive formula, the GC-4-3.5g compound provides maximum thermal conductivity without the risk of damaging sensitive components. Its enhanced micron-particle synthetic thermal filler further enhances its cooling capabilities, making it an ideal choice for demanding thermal management applications. The compound's viscosity allows for easy application, and it comes with a convenient applicator for effortless use.

Overall, the Gelid-Solutions GC-4-3.5g Thermal Compound is a top-of-the-line solution for users who demand the best in thermal interface technology. Its long-lasting performance, ease of application, and exceptional thermal conductivity make it a reliable choice for those seeking optimal cooling solutions for their high-performance systems.

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