Thermal Compound GC-4-1g

The Gelid-Solutions GC-4-1g Thermal Compound is specifically designed for professional and extreme users who demand top-notch thermal performance for their CPUs, GPUs, chipsets, and other critical applications. This cutting-edge thermal compound is engineered to facilitate highly efficient heat transfer, ensuring optimal cooling capabilities.

Featuring a polymer matrix as a binding agent for the thermal filler particles, this compound guarantees even distribution of the filler material, achieving flawless gap filling between the heat source and the cooling solution. Its unique composition also plays a key role in regulating the compound's viscosity, making it incredibly easy to apply.

With exceptional stability and performance across a broad temperature spectrum of -30 to 150°C, this compound maintains its effectiveness without the need for curing or hardening, ensuring consistently high thermal conductivity over time. Its enhanced micron-particle synthetic thermal filler delivers maximum thermal conductivity, while its non-electrical conductive and non-corrosive properties make it safe for use on a variety of components.

The Gelid-Solutions GC-4-1g Thermal Compound is not only incredibly efficient but also user-friendly, coming equipped with an additional applicator for effortless application. Experience superior cooling performance with this state-of-the-art thermal compound that is sure to meet the demands of even the most discerning users.

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