Thermal Compound Gel - Pack of 2

The Gelid-Solutions GC-4-3.5g Thermal Compound is a cutting-edge thermal interface designed for professional and extreme users seeking top-notch performance for their CPUs, GPUs, chipsets, and other critical applications. Engineered for ultra-efficient heat transfer, this compound ensures optimal cooling performance. It features a polymer matrix that binds the thermal filler particles, ensuring even distribution and perfect gap filling between the heat source and the cooling solution. The compound's viscosity allows for easy application, while its stability and performance remain exceptional across a wide temperature range (-30 to 150°C) without curing or hardening over time.

With an enhanced micron-particle synthetic thermal filler, this compound offers maximum thermal conductivity. It is non-electrical conductive and non-corrosive, providing peace of mind when applied to sensitive components. The easy-to-use formulation comes with an additional applicator for effortless application, making it a convenient solution for users of all levels.

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